Silicone-Free Heat Sink Compound, 1lb Jar
Hisco #:1978-1-50391
MFG #:1978-1
Item must be ordered in multiples of 1
The Techspray 1978-1 is Silicone-Free Heat Sink Compound that draws heat away when applied to a component. In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical applications, it is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required. Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects.
The Techspray 1978-1 Specifications:- Series: 1978
- Product Type: Heat Sink Compound
- Container Size: 1lb
- Container Type: Jar
- Color: Gray
- Primary Color: Gray
- Chemical Composition: Zinc Oxide
- Applications: Electronic
- Minimum Operating Temperature: -40°F
- Maximum Operating Temperature: +392°F
Product Description
The Techspray 1978-1 is Silicone-Free Heat Sink Compound that draws heat away when applied to a component. In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical applications, it is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required. Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects.
The Techspray 1978-1 Specifications:- Series: 1978
- Product Type: Heat Sink Compound
- Container Size: 1lb
- Container Type: Jar
- Color: Gray
- Primary Color: Gray
- Chemical Composition: Zinc Oxide
- Applications: Electronic
- Minimum Operating Temperature: -40°F
- Maximum Operating Temperature: +392°F
Technical Information
Item must be ordered in multiples of 1