US_HISCO_SPIRE

EXTENDED FOR A LIMITED TIME: 10% Off Solder Wire & Bars on orders over $500 – Online Only Until 11/15 – Use Code SOLDER10

AI Technology logo

Die Attach Paste Adhesive and Underfill for Large and Small Dies, 8cc Fill in a 10cc Syringe, EFD

Hisco #:ME7665-SC-8-1572

MFG #:ME7665-SC

This item has a required storage/handling temperature range outside of ambient. Please review the TDS for more information.
This item must be shipped with dry ice. Your order will be subject to an additional fee which will appear on your invoice.
$
Manufacturer Estimated Lead Time When Not In Stock25 days
Minimum Order QTY: 27
Item must be ordered in multiples of 27

Product Description

Technical Information

BrandAI Technology

Additional Resources

$
 
Minimum Order QTY: 27
Item must be ordered in multiples of 27