Underfill Encapsulant for BGA and CSP, 55cc Syringe
Hisco #:CN-1739-57150
MFG #:CN-1739
$
Manufacturer Estimated Lead Time When Not In Stock: 25 days
Minimum Order QTY: 15
Item must be ordered in multiples of 15
Item must be ordered in multiples of 15
The Zymet CN-1739 is a reworkable underfill encapsulant that is capable of enhancing the board level reliability of WL-CSP's, FO-WLP's, CSP's, and BGA's. It flows rapidly and cures quickly at low temperatures. This encapsulant exhibits excellent adhesion to organic substrates.
Zymet CN-1739 Specifications:- Brand: Zymet
- Container Type: 55cc Syringe
- Color: Black
- Shelf Life @ -5°C: 6 months
- Pot Life @ 25°C: 7 days
- Storage Modulus, GPa (DMA): 3.2
- Storage and Handling: Store at -5°C or below. Thaw packages slowly, to room temp. before opening
Product Description
Technical Information
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Product Description
The Zymet CN-1739 is a reworkable underfill encapsulant that is capable of enhancing the board level reliability of WL-CSP's, FO-WLP's, CSP's, and BGA's. It flows rapidly and cures quickly at low temperatures. This encapsulant exhibits excellent adhesion to organic substrates.
Zymet CN-1739 Specifications:- Brand: Zymet
- Container Type: 55cc Syringe
- Color: Black
- Shelf Life @ -5°C: 6 months
- Pot Life @ 25°C: 7 days
- Storage Modulus, GPa (DMA): 3.2
- Storage and Handling: Store at -5°C or below. Thaw packages slowly, to room temp. before opening
Technical Information
Brand: Zymet
$
Minimum Order QTY: 15
Item must be ordered in multiples of 15
Item must be ordered in multiples of 15