Zymet TC-601 Ultralow Stress Die Attach Adhesive For Stress Sensitive Devices, 5 cc
Hisco #:TC-601-1-5-57150
MFG #:TC-601-1-5
$
Manufacturer Estimated Lead Time When Not In Stock: 18 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
The Zymet TC-601-1-5 is specifically designed for the bonding of stress sensitive devices such as microelectronic and micro-machined sensors.
Zymet TC-601-1-5 Features:- Thermal stability to 250°C
- Low ionic contamination
- Thermal Conductivity
- Brand: Zymet
- Container Capacity: 5cc
Product Description
Technical Information
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Product Description
The Zymet TC-601-1-5 is specifically designed for the bonding of stress sensitive devices such as microelectronic and micro-machined sensors.
Zymet TC-601-1-5 Features:- Thermal stability to 250°C
- Low ionic contamination
- Thermal Conductivity
- Brand: Zymet
- Container Capacity: 5cc
Technical Information
Brand: Zymet
$
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1