Shin Etsu SES22533-60 Potting Encapsulant, Dual Component, Part A, 18kg pail
Hisco #:SES22533-60-A-18KG
MFG #:SES22533-60-A-18KG
$
Manufacturer Estimated Lead Time When Not In Stock: 112 days
Minimum Order QTY: 10
Item must be ordered in multiples of 10
Item must be ordered in multiples of 10
The Shin-Etsu SES22533-60-A-18KG is a dual component, room temperature cure, self leveling potting encapsulent that cures to form a durable, flexible rubber to protect electronic components. SES22533-60 A/B exhibits excellent unprimed adhesion to most circuit board substrates, metals, plastics, glass, and ceramics.
Features:
- Dual component
- 1:1 mix ratio
- Roomtemperature cure
- Self-leveling
Applications:
- Protecting and electrically isolating electronic components
- Stress reduction
Product Description
Technical Information
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Product Description
WARNING: Cancer and Reproductive Harm - www.P65Warnings.ca.gov
The Shin-Etsu SES22533-60-A-18KG is a dual component, room temperature cure, self leveling potting encapsulent that cures to form a durable, flexible rubber to protect electronic components. SES22533-60 A/B exhibits excellent unprimed adhesion to most circuit board substrates, metals, plastics, glass, and ceramics.
Features:
- Dual component
- 1:1 mix ratio
- Roomtemperature cure
- Self-leveling
Applications:
- Protecting and electrically isolating electronic components
- Stress reduction
Technical Information
Brand: Shin-Etsu
Weight: 39.672000000000004
Country Of Origin: US
Harmonized Code: 3907.30.0000
$
Minimum Order QTY: 10
Item must be ordered in multiples of 10
Item must be ordered in multiples of 10