US_HISCO_SPIRE

EXTENDED FOR A LIMITED TIME: 10% Off Solder Wire & Bars on orders over $500 – Online Only Until 11/15 – Use Code SOLDER10

Thermal Cure Silicone System, 850G AG/CU, CHOFORM 2 Part Kit

Hisco #:19-26-5513-0850-5200

MFG #:19-26-5513-0850

$
Manufacturer Estimated Lead Time When Not In Stock45 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1

Product Description

Technical Information

BrandParker
Weight: 2.1

Additional Resources

$
 
Minimum Order QTY: 1
Item must be ordered in multiples of 1