ThermoBond Cir-Kits
Hisco #:6993-0176-37629
MFG #:6993-0176
$
Manufacturer Estimated Lead Time When Not In Stock: 23 days
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1
The PACE 6993-0176 is a thermobond circuit kit.
The PACE 6993-0176 Specifications:- Accessory Type: Thermobond Circuit Kit
- Material: Copper Foil
- Material Category: Metal
- Includes: Chip Resistor/Capacitor 1200-0147-01 Inductors, MELFs, Tantalum Capacitors 1200-0148-01 SOTs 1200-0149-01 SOICs, TSOPs 1200-0150-01 PLCCs, LCCCs, SOJs, Ceramic QFPs, Basic Cir-Kit Material 1200-0151-01 and Dry Film Adhesive for Custom Shaping/Cutting PQFP
Product Description
Technical Information
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Product Description
The PACE 6993-0176 is a thermobond circuit kit.
The PACE 6993-0176 Specifications:- Accessory Type: Thermobond Circuit Kit
- Material: Copper Foil
- Material Category: Metal
- Includes: Chip Resistor/Capacitor 1200-0147-01 Inductors, MELFs, Tantalum Capacitors 1200-0148-01 SOTs 1200-0149-01 SOICs, TSOPs 1200-0150-01 PLCCs, LCCCs, SOJs, Ceramic QFPs, Basic Cir-Kit Material 1200-0151-01 and Dry Film Adhesive for Custom Shaping/Cutting PQFP
Technical Information
Brand: PACE
Weight: 1
Country Of Origin: US
Harmonized Code: 8515.90.4000
$
Minimum Order QTY: 1
Item must be ordered in multiples of 1
Item must be ordered in multiples of 1