RTV Thermally Conductive Silicone, Controlled Volatility, Two-Part
Hisco #:CV-2960-33053
MFG #:CV-2960
Item must be ordered in multiples of 1
The NuSil CV-2960 is a flowable, white, thermally conductive silicone that is able to provide moderate heat transfer between electrical components and their heat sinks. This product can be used for adhereing openings in housing and modules where grooves or other configurations require a limited flow material. It can also protect sensitive devices from condensation in environments that have extreme operating conditions.
Features and Benefits:
NuSil CV-2960 Features:- Two-part, white, flowable, thermally conductive silicone
- Cures with the addition of heat
- 10: 1 Mix Ratio (Part A: Part B)
Application:
- For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
- To provide moderate heat transfer between electrical/electronic components and their heat sinks
- Use for adhering openings in modules and housing where grooves or other configurations require a limited flow material
Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of =1% and CVCM of =0.1%
Product Description
The NuSil CV-2960 is a flowable, white, thermally conductive silicone that is able to provide moderate heat transfer between electrical components and their heat sinks. This product can be used for adhereing openings in housing and modules where grooves or other configurations require a limited flow material. It can also protect sensitive devices from condensation in environments that have extreme operating conditions.
Features and Benefits:
NuSil CV-2960 Features:- Two-part, white, flowable, thermally conductive silicone
- Cures with the addition of heat
- 10: 1 Mix Ratio (Part A: Part B)
Application:
- For applications requiring low outgassing and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
- To provide moderate heat transfer between electrical/electronic components and their heat sinks
- Use for adhering openings in modules and housing where grooves or other configurations require a limited flow material
Meets or exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of =1% and CVCM of =0.1%
Technical Information
Item must be ordered in multiples of 1