ALPHA Capillary Underfill, CU13-3150, Thermal Cure, Iwashita Syringe, 11 Gram, 10CC
Hisco #:249742-0011GMI-1998
MFG #:249742.0011GMI
$
Manufacturer Estimated Lead Time When Not In Stock: 7 days
Minimum Order QTY: 29
Item must be ordered in multiples of 29
Item must be ordered in multiples of 29
The ALPHA 249742.0011GMI is a one-component, low temperature thermal cure capillary underfill designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed circuit boards.
ALPHA 249742.0011GMI Features:- Low temperature thermal cure underfill
- Low Viscosity due to no filler
- Fast Cure at Low Temperatures
- Excellent adhesion and Drop Shock performance
- Anhydride Free
- NON-REWORKABLE
Product Description
Technical Information
SDS/TDS
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Product Description
WARNING: Cancer and Reproductive Harm - www.P65Warnings.ca.gov
The ALPHA 249742.0011GMI is a one-component, low temperature thermal cure capillary underfill designed for low temperature applications requiring enhanced mechanical strength for chip packages assembled onto printed circuit boards.
ALPHA 249742.0011GMI Features:- Low temperature thermal cure underfill
- Low Viscosity due to no filler
- Fast Cure at Low Temperatures
- Excellent adhesion and Drop Shock performance
- Anhydride Free
- NON-REWORKABLE
Technical Information
Brand: Alpha
Country Of Origin: KR
Harmonized Code: 3506.10.5000
$
Minimum Order QTY: 29
Item must be ordered in multiples of 29
Item must be ordered in multiples of 29