3M™ Thermal Bonding Film AF111, 7 in x 36 yds, 5/Case
Hisco #:00021200204562-31196
MFG #:7000121222
Item must be ordered in multiples of 5
3M™ Thermal Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials (epoxy and phenolic).
This hot melt film adhesive may be cured at temperatures as low as 225 Degrees F. Provides excellent strength for either metal to melt or honeycomb sandwich applications. Releases no volatile by-products during cure thereby permitting low pressure bonding. Standard Lead Time: 30 Calendar Days
3M 7000121222 Features:- Moderate tack
- Thick 10 mil caliper
- 250° F (121° C) cure
- High metal OLS and peel adhesion
- High flow
- 40° F (4° C) storage required
- Package Quantity: 5 RLS
- Part Number: AF111
Product Description
3M™ Thermal Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials (epoxy and phenolic).
This hot melt film adhesive may be cured at temperatures as low as 225 Degrees F. Provides excellent strength for either metal to melt or honeycomb sandwich applications. Releases no volatile by-products during cure thereby permitting low pressure bonding. Standard Lead Time: 30 Calendar Days
3M 7000121222 Features:- Moderate tack
- Thick 10 mil caliper
- 250° F (121° C) cure
- High metal OLS and peel adhesion
- High flow
- 40° F (4° C) storage required
- Package Quantity: 5 RLS
- Part Number: AF111
Technical Information
Item must be ordered in multiples of 5